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NTGS3441P
Power MOSFET
?20 V, ?3.16 A, Single P?Channel TSOP?6
Features
? Ultra Low R DS(on) to Improve Conduction Loss
? Low Gate Charge to Improve Switching Losses
? TSOP?6 Surface Mount Package
? This is a Pb?Free Device
Applications
? High Side Switch in DC?DC Converters
? Battery Management
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
?20 V
http://onsemi.com
R DS(ON) TYP
91 m W @ 4.5 V
144 m W @ 2.7 V
188 m W @ 2.5 V
P?Channel
I D MAX
?3.16 A
Parameter
Drain?to?Source Voltage
Gate?to?Source Voltage
Symbol
V DSS
V GS
Value
?20
± 12
Unit
V
V
1 2 5 6
Continuous Drain
Current (Note 1)
Power Dissipation
Steady
State
t = 10 s
Steady
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
I D
P D
?2.5
?1.8
?3.16
0.98
A
W
3
4
(Note 1)
State
MARKING
t = 10 s
1.60
DIAGRAM
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
?1.8
?1.3
0.51
A
W
1
TSOP?6
CASE 318G
STYLE 1
1
S3 M G
G
Pulsed Drain Current
t p = 10 m s
I DM
?13
A
PT = Device Code
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T J ,
T STG
I S
T L
?55 to
150
?1.5
260
° C
A
° C
M = Date Code
G = Pb?Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
Drain Drain Source
Maximum ratings are those values beyond which device damage can occur.
6
5
4
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface?mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in
sq [1 oz] including traces)
2. Surface?mounted on FR4 board using the minimum recommended pad size
1 2 3
Drain Drain Gate
(Cu area = 0.0751 in sq)
ORDERING INFORMATION
Device
NTGS3441PT1G
Package
TSOP?6
Shipping ?
3000 / Tape & Reel
(Pb?Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2006
January, 2006 ? Rev. 0
1
Publication Order Number:
NTGS3441P/D
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